Odisha-Intel-3DGS MoU: $3.3 Billion Glass Substrate Plant
Why in the news
The Odisha government agreed a large semiconductor investment deal with Intel and a partner firm, 3D Glass Solutions.
Key facts
- Signatories: Government of Odisha, Intel and 3D Glass Solutions (3DGS).
- Investment size: USD 3.3 billion.
- Product: advanced packaging glass-core substrates, including high-density interconnect substrates.
- Location: Bhubaneswar-Khurda region of Odisha.
- Policy link: strengthens the ecosystem under the India Semiconductor Mission.
Exam angle
- State involved: Odisha; companies: Intel and 3DGS.
- Focus is chip packaging technology, not wafer fabrication.
- Mission to remember: India Semiconductor Mission.